RuiLi Tape

Definition of Polyimide Industry

The polyimide (PI) industry is an industrial chain system centered around polyimide materials, covering their research and development, production, processing, and application. Polyimide is a high-performance polymer material known as the “golden polymer material” due to its extreme high temperature resistance, chemical stability, mechanical strength, and electrical insulation properties. It is widely used in high-precision fields such as electronics, aerospace, and new energy.


Core elements of industry definition**

  1. * * Material characteristics**
    -Molecular structure: The main chain contains repeated imide rings (- CO-NR-CO -), which endow it with high thermal stability and rigidity.
    -* * Performance label * *: High temperature resistance (long-term use temperature>250 ℃), radiation resistance, corrosion resistance, low dielectric constant (suitable for high-frequency scenarios), high mechanical strength.
  2. * * Composition of the industrial chain**
    -Upstream: Raw material suppliers (such as diamines, dianhydride monomers, such as ODA, PMDA, etc.).
    -* * Middle stream * : manufacturing of polyimide resin, film, fiber, foam and other forms. – * Downstream * *: Terminal applications in electronics, aerospace, automotive, new energy, military industry, etc.
  3. * * Product Form**
    -* * Thin film * * (such as flexible circuit substrate, insulation tape);
    -Resin (high-temperature resistant coating, adhesive);
    -* * Fiber * * (fireproof clothing, high-temperature filter material);
    -* * foam * * (spacecraft thermal insulation material).

Industry Development Status**

  1. High technical barriers**
    -The synthesis process is complex (requiring high-temperature condensation and imidization), and the purity requirements for raw materials are extremely high (such as monomer ODA, PMDA).
    -High end products such as transparent polyimide and ultra-thin films are monopolized by American and Japanese companies such as DuPont, Ube Industries, and Zhongyuan Chemical.
  2. * * Market demand driven**
    -* * Electronic field * : 5G communication, flexible display (foldable screen phones), chip packaging (PI photoresist). – * New energy * *: lithium battery separator, fuel cell proton exchange membrane.
    -Aerospace: Lightweight high-temperature components (engine hood, satellite thermal control film).

Industry Development Trends**

  1. * * Domestic substitution acceleration**
    -Policy support (Guidelines for the Development of New Materials Industry) promotes the research and development of high-end PI materials and reduces dependence on imports.
  2. * * Expansion of Emerging Applications**
    -* * Flexible Electronics * *: Foldable devices, flexible sensors;
    -New energy vehicles: motor insulation system, battery thermal management;
    -Semiconductor: Advanced packaging with PI photoresist.
  3. * * Greening and low-cost**
    -Develop bio based monomers (to reduce petroleum dependence) and optimize synthesis processes (low-temperature solution method).

Industry Challenges**

-Raw material monopoly: Key monomers (such as PMDA) are controlled by Japanese companies such as Ube and Mitsubishi;
-* * Equipment limitations * *: High end film production relies on imported equipment (such as biaxial stretching machines);
-Environmental pressure: Traditional processes using toxic solvents (such as DMAC) require a transition to green processes.


* * Summary**

The polyimide industry is a typical high-tech barrier and high value-added new material field, and its development level directly reflects a country’s competitiveness in high-end manufacturing and cutting-edge technology fields. In the future, industry growth will rely on * * technological breakthroughs * * (monomer synthesis, process optimization), * * industry chain collaboration * * (upstream and downstream support), and * * application scenario innovation * * (such as deep space exploration, artificial intelligence hardware).

Leave a Reply

Your email address will not be published. Required fields are marked *